Packaging
We offer the highest quality, most economicallypriced static shield packaging available. With 40% light transparency, itallows for easy identification of IC's (integrated circuits) and PCB's (printedcircuit boards). The extremely durable buried metal contruction gives FaradayCage performance needed to effectively shield these componenets against staticcharge.
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.
Global Shipment by DHL/FedEx/TNT/UPS
Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
| Shipment charges: |
(Reference DHL and FedEX) |
| Weight(KG): 0.00kg-1.00kg |
Price(USD$) : USD$60.00 |
| Weight(KG): 1.00kg-2.00kg |
Price(USD$) : USD$80.00 |
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.
- Other Shipment Way: SF Express for Asia; Chang-woo special air line for Korea, Aramexfor Middle East countries. Others more shipping way, please contact us.
We also can send the goods to your forwarder or your othersupplier, so that you can send the goods together. It may will save shipmentcharges for you, or may will more convenient for you.
- Shipping Details: Shippinginformation, We need shipping information including Receiver Company Name(Or personal), Receiver Name, Contact Number, Address and Zip Code. Please make sure these information to us, so that we can arrange the shipment faster.
- Delivery time: Deliverytime will need 2-5days to most of country all over the world for DHL/UPS/FEDEX/TNT.
XC17S20VO8C Product Details:
"XC17S20VO8C: A Comprehensive Guide to Integrated Circuits for FPGA Configuration PROMs"
Integrated circuits (ICs) are the fundamental building blocks of modern technology, and their significance is only growing. One such IC, the XC17S20VO8C, is a Memory-Configuration PROM designed for FPGA. In this article, we will provide an in-depth analysis of XC17S20VO8C, highlighting its classification, features, and application scenarios, usage, and manufacturing process.
XC17S20VO8C is a versatile IC designed for configuring Field-Programmable Gate Arrays (FPGA) today. It boasts an impressive range of features, including a configuration PROM with a storage capacity of 200K, in a compact 8-SOIC package, and a power supply voltage of 3V to 3.6V.
Its main features include output voltage, current, power, accuracy, efficiency, and temperature range. XC17S20VO8C operates over a broad temperature range, -40°C to 85°C, making it ideal for a wide range of industrial applications.
The XC17S20VO8C IC is ideally suited for applications in the telecommunications, networking, aerospace, automotive, and medical devices sectors. It is perfect for FPGA configuration, which is a critical component in the development of high-performance electronics useful in diverse electronic devices such as routers, servers, and cell phones.
Integrated circuits are classified into different categories such as digital, analog, mixed-signals, and RF. The XC17S20VO8C belongs to the memory configuration PROMs' category, which is a subset of digital ICs, designed to store digitized data temporarily or permanently. Within the digital category, XC17S20VO8C is designed specifically for FPGA configuration.
It is important to note that manufacturing ICs is an incredibly intricate process that involves chip design, cutting, cleaning, laser processing, back grinding, doping, exposure, vapor deposition, etching, and more. Finished products need to undergo appropriate packaging and testing to ensure component quality. The XC17S20VO8C has undergone rigorous testing to ensure its quality and reliability.
In summary, the XC17S20VO8C is an adaptable and high-speed configuration PROM designed to configure Field-Programmable Gate Arrays. It boasts a wide range of features that make it ideal for industrial applications. This article has not only highlighted the XC17S20VO8C's primary features and performance parameters but also its classification, application scenarios, usage, as well as the complex manufacturing process that goes into making it. Any engineer looking to design a high-quality FPGA should consider the XC17S20VO8C IC.