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AMD
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XC2VP2-6FF672I

Manufacturer Part Number:
XC2VP2-6FF672I
Manufacturer / Brand
AMD
Part of Description:
IC FPGA 204 I/O 672FCBGA
Datasheets:
XC2VP2-6FF672I(1).pdfXC2VP2-6FF672I(2).pdfXC2VP2-6FF672I(3).pdf
Lead Free Status / RoHS Status:
RoHS non-compliant
Stock Condition:
New original, Stock Available.
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number XC2VP2-6FF672I
Manufacturer / Brand AMD
Category Integrated Circuits (ICs) > Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 204 I/O 672FCBGA
Lead Free Status / RoHS Status: RoHS non-compliant
Voltage - Supply 1.425V ~ 1.575V
Total RAM Bits 221184
Supplier Device Package 672-FCBGA (27x27)
Series Virtex®-II Pro
Package / Case 672-BBGA, FCBGA
Package Tray
Operating Temperature -40°C ~ 100°C (TJ)
Number of Logic Elements/Cells 3168
Number of LABs/CLBs 352
Number of I/O 204
Mounting Type Surface Mount
Base Product Number XC2VP2

Packaging

We offer the highest quality, most economicallypriced static shield packaging available. With 40% light transparency, itallows for easy identification of IC's (integrated circuits) and PCB's (printedcircuit boards). The extremely durable buried metal contruction gives FaradayCage performance needed to effectively shield these componenets against staticcharge.

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



XC2VP2-6FF672I Product Details:

Title: Discover the Power of XC2VP2-6FF672I Integrated Circuit: A Comprehensive Introduction to Its Features and Applications XC2VP2-6FF672I is a field programmable gate array (FPGA), a type of programmable logic device. This highly versatile and efficient FPGA is equipped with a plethora of features and can be used in various industries and applications. Features and Performance Parameters: XC2VP2-6FF672I FPGA comes with 204 input/output (I/O) pins and has an integrated ratio of 2,048 equivalent macrocells. It offers a wide operating temperature range of -40°C to 100°C, making it suitable for different climatic conditions. The FPGA features an output voltage of 1.2V and 1.5V and operates on a maximum current of 35A, providing optimal power. Its high accuracy and efficiency ensure that it provides a stable output with low noise levels. Application Scenarios and Usages: XC2VP2-6FF672I can be used in various electronic devices, including communication systems, embedded processing, computing, storage, medical equipment, and more. It is a popular choice for industries that require high-performance computing, such as aerospace, automotive, and defense. Types of Integrated Circuits: Integrated circuits are classified into four types: digital, analog, mixed signal, and radio frequency (RF). This FPGA is a type of digital integrated circuit that offers a wide range of digital signal processing capabilities and is known for its flexible architecture. Complex Manufacturing Process: The manufacturing of integrated circuits involves several complex processes, including chip design, wafer cutting, cleaning, laser processing, back-grinding, doping, exposure, vapor deposition, etching, and more. Each of these processes is essential to developing a quality product. Packaging and Testing: After the manufacturing process, the finished products undergo appropriate packaging and testing to ensure component quality. Packaging involves encapsulation, which protects the IC from degradation due to environmental factors. Testing is done to ensure that the IC meets the required specifications of the product. Conclusion: XC2VP2-6FF672I is a highly versatile and efficient FPGA that can be used in various electronic, industrial and commercial applications. Its design, complex manufacturing processes, and quality testing, make it highly popular in the electronics industry. With a better understanding of the XC2VP2-6FF672I FPGA's features and capabilities, you can make the right choice in utilizing this technology in your next venture.

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