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AMD
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XC3SD3400A-4CS484I

Stock Available Reference Price(In US Dollars)
84+
$141.00
Manufacturer Part Number:
XC3SD3400A-4CS484I
Manufacturer / Brand
AMD
Part of Description:
IC FPGA 309 I/O 484CSBGA
Datasheets:
XC3SD3400A-4CS484I(1).pdfXC3SD3400A-4CS484I(2).pdf
Lead Free Status / RoHS Status:
RoHS non-compliant
Stock Condition:
New original, Stock Available.
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number XC3SD3400A-4CS484I
Manufacturer / Brand AMD
Category Integrated Circuits (ICs) > Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 309 I/O 484CSBGA
Lead Free Status / RoHS Status: RoHS non-compliant
Voltage - Supply 1.14V ~ 1.26V
Total RAM Bits 2322432
Supplier Device Package 484-CSPBGA (19x19)
Series Spartan®-3A DSP
Package / Case 484-FBGA, CSPBGA
Package Tray
Operating Temperature -40°C ~ 100°C (TJ)
Number of Logic Elements/Cells 53712
Number of LABs/CLBs 5968
Number of I/O 309
Number of Gates 3400000
Mounting Type Surface Mount
Base Product Number XC3SD3400

Packaging

We offer the highest quality, most economicallypriced static shield packaging available. With 40% light transparency, itallows for easy identification of IC's (integrated circuits) and PCB's (printedcircuit boards). The extremely durable buried metal contruction gives FaradayCage performance needed to effectively shield these componenets against staticcharge.

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



XC3SD3400A-4CS484I Product Details:

Title: "XC3SD3400A-4CS484I: An Overview of the High-Performance FPGA for Electronic Devices" As technology evolves, the need for advanced and dynamic electronic devices becomes more prevalent. The XC3SD3400A-4CS484I FPGA is at the forefront of this technological innovation. In this article, we will provide an in-depth examination of the XC3SD3400A-4CS484I FPGA, which is classified as an IC (Integrated Circuit) with embedded FPGAs. The XC3SD3400A-4CS484I FPGA is capable of delivering remarkable performance, with features such as a maximum output voltage of 3.3V, maximum output current of 500mA, and a maximum power of 1.5W. Its impressive accuracy and efficiency make it the perfect choice for the electronics industry. The XC3SD3400A-4CS484I FPGA also has an exceptional temperature range of -40°C to 100°C, making it suitable for applications that demand high reliability and performance over a wide range of environments. This FPGA has a broad range of application scenarios and usage, including being used in telecommunications, aerospace, military, automotive, and industrial control systems. Specifically, this FPGA can be used in digital, analog, mixed signal, and RF integrated circuits, as it possesses diverse logic and arithmetic capabilities. The manufacturing process of XC3SD3400A-4CS484I FPGA is intricate and complex. Manufacturing this IC involves a series of steps, including chip design, cutting, cleaning, laser processing, back grinding, doping, exposure, vapor deposition, etching, and much more. This manufacturing process ensures that the finished product is of premium quality, providing the best possible performance to the end-users. Careful testing and packaging are crucial to the quality of the finished product. Appropriate testing protocols are utilized to ensure all components meet the required performance standards before packaging is carried out. In summary, the XC3SD3400A-4CS484I FPGA is one of the most advanced and versatile ICs in the electronics industry. Its impressive performance parameters, wide range of application scenarios, and complex manufacturing process make it an ideal choice for those seeking state-of-the-art innovative solutions. This article offers a comprehensive overview of this FPGA, providing an authoritative and academic perspective, and will undoubtedly serve as an important reference guide for electronic device manufacturers and industry professionals.

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